AMD has pledged to invest more than $10 billion across Taiwan's semiconductor and AI ecosystem. The U.S. chip maker aims to expand its strategic partnerships and scale advanced packaging manufacturing to support next-generation AI infrastructure.
As a leading challenger to Nvidia in AI computing chips, AMD will tap into the Taiwanese industry's expertise in high-performance computing. The company will specifically collaborate with Taiwanese firms ASE and SPIL to develop more power-efficient technology for AI systems and processors.
These investments will support the company's rack-scale Helios platform, which encompasses advanced silicon, packaging, and manufacturing partnerships. The Helios platform is set for deployment in the second half of 2026.